1107 hot melt glue stick is thermoplastic resin which could be used for the bonding of
electronic components such as basilar panel, capacitances, coil and copper, steel and
aluminum .It could also be used for bonding ABS,PVC,PET and the similar plastic material.
According with UL94-V0 and REACH standard.
Smokeless and Non-pungent odor.Fast curing and easy to operate
5.Hardness:80 Shore(A/ 30℃)
9.Viscosity(180 ℃ CPS):9000±1500